Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

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Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method

Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex .. read more

Rigid-Flex PCB Right the First Time - Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t .. read more

Next Generation Test Methodologies and Analysis for Physical Layer Structures

Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin .. read more

Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method

Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex .. read more

Rigid-Flex PCB Right the First Time - Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t .. read more

Next Generation Test Methodologies and Analysis for Physical Layer Structures

Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin .. read more