Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Defluxing of Copper Pillar Bumped Flip-Chips
Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving c
.. read more
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. read more
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application
The constant drive by designers to create more functionally unique products has challenged the assembly community for
some time. As a result,many processes have been developed under the “Necess
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
Defluxing of Copper Pillar Bumped Flip-Chips
Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving c
.. read more
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. read more
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Implementation of Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application
The constant drive by designers to create more functionally unique products has challenged the assembly community for
some time. As a result,many processes have been developed under the “Necess
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Challenges in Bare Die Mounting
Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where
reliability,size and weight were at a premium,and cost was a secondary considerati
.. read more
A Novel Epoxy Flux for Lead-Free Soldering
A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux
residue is designed to provide an interference-free service performance,in addition
.. read more
New Insights in Underfill Flow and Flip Chip Reliability
During the last years Flip Chip Technology has been widely accepted as a means for maximum miniaturization of
microelectronic assemblies. As an example the use of Flip Chips in advanced product
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more