Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more
Status and Outlooks of Flip Chip Technology
Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar
.. read more
Flip Chip Assembly of Thinned Silicon Die on Flex Substrates
The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for
applications ranging from smart cards to space-based radars. For hig
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more