Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

Filters
Filters
Reset Filters
Display

Assembly Challenges of Die and Die-Size BGAs

This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level .. read more

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow

A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp .. read more

Flip Chip Connections Using Bumps,Wells,and Imprinting

A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and wells filled with solder paste are provided on a flexible substrate serv .. read more

Assembly Challenges of Die and Die-Size BGAs

This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level .. read more

Enhanced Cleanability Using Fluxes with Decreased Viscosity after Reflow

A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the comp .. read more

Flip Chip Connections Using Bumps,Wells,and Imprinting

A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and wells filled with solder paste are provided on a flexible substrate serv .. read more