Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. read more
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. read more
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Multi-Stage Flux Filtration in Reflow Ovens
Flux management methods for reflow soldering have been debated for years. Current data suggests that multi-stage
filtration systems offer many benefits,particularly in dealing with the byproduc
.. read more
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. read more
The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Position Accuracy Machines for Selective Soldering Fine Pitch Components
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win
.. read more
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. read more
Selection of Wave Soldering Fluxes for Lead Free Assembly
The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the
relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
Multi-Stage Flux Filtration in Reflow Ovens
Flux management methods for reflow soldering have been debated for years. Current data suggests that multi-stage
filtration systems offer many benefits,particularly in dealing with the byproduc
.. read more
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. read more