Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more
Effect of QFN I/O Pad Solder Paste Overprint on Thermal Pad Void Reduction
QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc
.. read more
A Proposed Mechanism and Remedy for Ball-in-Socket and Foot-in-Mud Soldering Defects on Ball Grid Array and Quad Flat Pack Components
A common source of defects on area array components is the “ball-in-socket” (or “pillowhead”) defect. This defect is
defined as one or more connections that show physical contact but no wetting
.. read more