Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Optimization Study for Solder Pastes Used in Wafer Bumping Applications
Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder
paste printing applications are approaching that of typical bumping technologie
.. read more
Selective Soldering Of Flexible Circuits Using Diode Lasers
The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact
heating technique is ideal for components that require careful handling whic
.. read more