Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights
Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
“Metal Whiskers” Does Surface Contamination Have an Effect of Whisker Formation?
Foresite has investigated many whisker failures and found that consistent high levels of chloride,sulfate and amines are present in and around the areas of whisker formation even in hot dry env
.. read more
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights
Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Understanding SIR
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ
significantly from those stated by the solder material provider. The
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Creep Corrosion of PWB Final Finishes: Its Cause and Prevention
As the electronic industry moves to lead-free assembly and finer-pitch circuits,widely used printed wiring board (PWB) finish,SnPb HASL,has been replaced with lead-free and coplanar PWB finishe
.. read more
“Metal Whiskers” Does Surface Contamination Have an Effect of Whisker Formation?
Foresite has investigated many whisker failures and found that consistent high levels of chloride,sulfate and amines are present in and around the areas of whisker formation even in hot dry env
.. read more
Engineered Cleaning Fluids Designed for Batch Processing
Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more