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Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more
Using Flux-Coated Solder Preforms to Repeatably Achieve Low Voiding in Power ICs: An Automotive Case Study
For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a
.. read more