The Standards You Need. Built Around the Way You Design.
From foundational PCB design to manufacturability, materials and advanced packaging, IPC Design Suites bring together essential standards for key stages of the design process.
Get the guidance you need to make informed design decisions, communicate requirements clearly and build reliability and manufacturability into your designs from the start.
Built For Every Stage Of The Design Process
Great designs depend on more than one decision or one standard. Board construction, materials, manufacturability, electrical performance, component selection and packaging all influence how successfully a design moves from concept to production.
IPC Design Suites make it easier to find the standards that apply to the work you're doing. Each suite brings together complementary IPC standards around a specific design need, helping you apply trusted industry guidance without having to identify every relevant standard individually.
Find the Right Standards for Your Design Needs
Core PCB Design → Design Core Suite
Design for Manufacturing → DFM Enablers Suite
Materials & Finishes → Materials Suite
Advanced Packaging → Packaging Applications & Embedded Guidance Suite
Design Core Suite
Start with a Stronger Design Foundation
Build consistency into your PCB designs from the beginning.
The Design Core Suite brings together foundational IPC standards for rigid, flexible, rigid-flex and high-frequency printed board design. Together, they provide a common framework for making design decisions, communicating requirements and creating greater consistency across products, teams and suppliers.
Use the suite to:
- Establish consistent design practices across product lines
- Improve communication of design requirements
- Reduce supplier-to-supplier variability
- Create stronger alignment between design and manufacturing
- Build the foundation for Design for Manufacturability (DFM)
Standards Included:
IPC-2221 | IPC-2222 | IPC-2223 | IPC-2228
These cover generic printed board design requirements along with more specialized guidance for rigid, flexible/rigid-flex and RF/microwave printed boards.
Designed for:
PCB Design Engineers • Reliability Engineers • Design Release Engineers • Supplier Quality Engineers • Hardware/System Design Engineers
DFM Enablers Suite
Design with Manufacturing in Mind
A design that works on screen still needs to work on the manufacturing floor.
The DFM Enablers Suite helps designers evaluate the manufacturing implications of their decisions earlier in the design process. It brings together guidance covering DFX, land patterns, impedance control and current-carrying capacity so design teams can better align design intent with manufacturing capabilities.
Use the suite to:
- Identify important DFM considerations before design release
- Understand how design decisions affect manufacturing
- Improve component and land-pattern decisions
- Address controlled impedance requirements
- Evaluate current-carrying capacity
- Reduce avoidable design-to-manufacturing issues
Standards Included:
IPC-2231 | IPC-7351 | IPC-7352 | IPC-2141 | IPC-2152
The Association's design resources identify these standards with DFX, surface-mount design and land patterns, controlled impedance and current-carrying capacity.
Designed to work with the Design Core Suite
The DFM Enablers Suite builds on the foundational guidance provided by the Design Core Suite.
Designed for:
PCB Design Engineers • Manufacturing Technologists • Layout Engineers • Hardware/System Design Engineers
Materials Suite
Choose Materials with Performance in Mind
The materials specified during design can directly affect electrical performance, thermal management, reliability and manufacturability.
The Materials Suite brings together IPC specifications covering key base materials, copper foil and surface finishes, giving design teams trusted guidance for defining material requirements that support the intended performance of the finished product.
Use the suite to:
- Align material choices with design and performance requirements
- Support electrical and thermal considerations
- Define consistent base-material requirements
- Better communicate material and finish requirements to manufacturers
- Help ensure material decisions support reliability and manufacturability
Standards Included:
IPC-4552 | IPC-4556 | IPC-4562 | IPC-4101 | IPC-4103
The broader IPC standards structure associates these documents with surface finishes, laminate/base materials and metal foil used in printed-board applications.
Designed for:
PCB Design Engineers • PCB Manufacturers • Hardware/System Design Engineers
Packaging Applications & Embedded Guidance Suite
Design for Today's Complex Component Technologies
Advanced component technologies introduce new electrical, mechanical, thermal and manufacturing considerations into PCB design.
The Packaging Applications & Embedded Guidance Suite brings together IPC guidance for implementing a range of component and packaging technologies, helping designers understand the unique considerations that come with each approach.
Use the suite to:
- Understand design and assembly considerations for advanced packages
- Anticipate electrical, mechanical and thermal challenges
- Address package-specific manufacturing considerations
- Make more informed component implementation decisions
- Improve communication between design, manufacturing and reliability teams
Standards Included:
IPC-7091 | IPC-7092 | IPC-7093 | IPC-7094 | IPC-7095
Together, these standards address the design and assembly implementation of 3D components, embedded circuitry, bottom termination components (BTCs), flip chip and die-size components, and ball grid arrays (BGAs).
Designed for:
PCB Design Engineers • Layout Engineers • Manufacturing Technologists/Engineers • Reliability Engineers • Supplier Quality Engineers • Hardware/System Design Engineers
Explore the Packaging Applications & Embedded Guidance Suite
One Industry. One Common Language for Electronics Design.
IPC standards provide electronics professionals with industry-developed requirements, guidelines and best practices for designing and building reliable electronics.
The Design Suites make that guidance easier to navigate by bringing together standards around the challenges designers encounter throughout the development process.
Whether you're establishing foundational design requirements, preparing a design for manufacturing, specifying materials or working with advanced component technologies, there's an IPC Design Suite built to support the work.