Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Manufacturing of Low-Cost Wearable Vital Sign Monitoring Devices
Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms. General societal trends across the
.. read more
Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic
.. read more
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. read more
Manufacturing of Low-Cost Wearable Vital Sign Monitoring Devices
Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms. General societal trends across the
.. read more
Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic
.. read more
Folded-Flex and Stacked CSP,the 3D Solution for SiP Applications
The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative dev
.. read more