Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
.. read more
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. read more
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
.. read more
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
.. read more
Development of Printed Flex Circuits
•Developments of Printed FPCs
- PE resist for long FPCs
- Flexible Touch Sensor Panel(TSP) application
- Single-sided Printed FPCs
- Double-sided Printed FPCs
- Smart Printed FPCs
.. read more
Military Applications of Flexible Circuits
1.Conventional Flex
2.Basic Materials
3.Failure Modes
4.HDI Flex
Summary,conventional builds
Cautions in Design
•Average or above Design Expertise Required
–PTH to close to edge of part
–Panel
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. read more
Flex PCB Design for Panelization, Early Estimation for Better Utilization
This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the boa
.. read more
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. read more
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
.. read more
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
.. read more
Development of Printed Flex Circuits
•Developments of Printed FPCs
- PE resist for long FPCs
- Flexible Touch Sensor Panel(TSP) application
- Single-sided Printed FPCs
- Double-sided Printed FPCs
- Smart Printed FPCs
.. read more
Military Applications of Flexible Circuits
1.Conventional Flex
2.Basic Materials
3.Failure Modes
4.HDI Flex
Summary,conventional builds
Cautions in Design
•Average or above Design Expertise Required
–PTH to close to edge of part
–Panel
.. read more
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. read more
Flexural Fatigue Life Evaluation for Flexible Printed Circuit Boards
We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of
higher density and more sophisticated function of mobile devices and
.. read more
Development of Ultrasonic Flip Chip Bonding for Flexible Printed Circuit
Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding
technology. However,the requirement for finer pitch PCB is still increasi
.. read more