Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. read more
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. read more
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
FPGA on Board
Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the
number of FPGA designs implemented. Not only have the number of desig
.. read more
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. read more
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
Evaluation and Characterization of Molded flip-chip BGA Package for 28nm FPGA Applications
As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r
.. read more
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
FPGA on Board
Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the
number of FPGA designs implemented. Not only have the number of desig
.. read more