Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. read more
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
New Phosphorus-Based Curing Agents for PWB
As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther
.. read more
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more