Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates
The transition to lead-free solders has presented significant challenges for the electronics industry. One of the challenges is that typical lead-free soldering temperatures are much higher tha
.. read more
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. read more
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties
With the miniaturization of electronic devices1,the need for more versatile materials to make these devices increases. Coupled with the gradual removal of lead-based solders2,thermal stability
.. read more
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. read more
The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates
The transition to lead-free solders has presented significant challenges for the electronics industry. One of the challenges is that typical lead-free soldering temperatures are much higher tha
.. read more
Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate
Phenolic cure of epoxy resins produces high glass transition temperature materials for electrical laminates fabrication. These resins are brittle due to the high crosslink densities. Consequent
.. read more