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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. read more
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. read more
Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. read more
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. read more