Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. read more
Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
.. read more
Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more
Grain Refinement for Improved Lead-Free Solder Joint Reliability
The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
New Technology to Improve Etching Performance using Shiny Side Surface Treatment for HDI
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil. Until now,a lot of electro-deposited copper foils (ED foil) with very low
.. read more
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
.. read more
Utilizing 3D Package Technology for Complex SiP Applications - Innovative Solutions for System Level Integration and Miniaturization
Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each
generation,companies are offering more and more features and/or capability.
.. read more
Whisker Prevention
The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is
one of the alternatives and may be the simplest system as a “drop-in” replac
.. read more
Taking the Pain Out of Pb-Free Reflow
The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process.
The largest changes are in the reflow process,as Pb-free pastes requ
.. read more