Knowledge Hub

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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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A New Halogen-Free Vapor Phase Coating for High Reliability & Protection of Electronics in Corrosive and Other Harsh Environments

The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. Halogen .. read more

The Role of Organic Amines in Soldering Materials

The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater .. read more

Halogen Free Solder Paste

•What is a halogen? •Impact on the environment •Halides and halogens •Halides in electronics •Halogens in electronics •Definition of halogen free •Technical challenges to remove halogen •Curren .. read more

iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials

Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed circuit boards (PCB) have prompted market demand for HFR-free computer sy .. read more

Correlation of Sir,Halide/Halogen,and Copper Mirror Tests

With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho .. read more

Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development

The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin .. read more

An Innovative High CTI RCC Material

Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has already been not satisfied with double sided design and requested thinner & mul .. read more

IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. read more

A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates

As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu .. read more

A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry

Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and r .. read more

The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials

This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir .. read more

Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning

The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring .. read more

Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds

The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco .. read more

Lead-Free Flux Technology and Influence on Cleaning

Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi .. read more

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor

Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l .. read more

Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties

Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic .. read more

Solder Paste Residue Corrosivity Assessment: Bono Test

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00 .. read more

A Novel Halogen-Free Material for High Speed PCB

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. read more

Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins

An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame retardant epoxy resins use bromine-containing flame-retardants. In t .. read more

Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies

The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability .. read more

Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate material properties thereby creating a shift in the performance and re .. read more

Designers Guide to Lead-Free SMT: Components,PCB Materials,Plating and Surface Coatings

For decades the manufacturers of electronic components have furnished products that were most compatible with soldering processes that employed a eutectic alloy composition that contained tin a .. read more

Design for Low-Halogen Green Electronics

Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the hottest topics for the upcoming years. Besides reduction of consu .. read more

Challenges toward Implementing a Halogen-Free PCB Assembly Process

The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro .. read more

RoHS and Green Compliance in IC Packaging

In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag .. read more

Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates

Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As operating frequencies increase beyond one Gigahertz the availability .. read more

A Comparative Study of PWB’s Containing Halogenated and Halogen Free Flame-Retardants

In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison between several different PWB’s each having different flame-retardant package .. read more

A New Halogen-Free Vapor Phase Coating for High Reliability & Protection of Electronics in Corrosive and Other Harsh Environments

The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. Halogen .. read more

The Role of Organic Amines in Soldering Materials

The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater .. read more

Halogen Free Solder Paste

•What is a halogen? •Impact on the environment •Halides and halogens •Halides in electronics •Halogens in electronics •Definition of halogen free •Technical challenges to remove halogen •Curren .. read more

iNEMI HFR-Free Signal Integrity Project: An Investigation to Identify Degradation of Electrical Signals in HFR-Free PCB Materials

Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed circuit boards (PCB) have prompted market demand for HFR-free computer sy .. read more

Correlation of Sir,Halide/Halogen,and Copper Mirror Tests

With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho .. read more

Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development

The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin .. read more

An Innovative High CTI RCC Material

Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has already been not satisfied with double sided design and requested thinner & mul .. read more

IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. read more

A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates

As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu .. read more

A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry

Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and r .. read more

The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials

This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir .. read more

Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning

The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring .. read more

Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds

The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco .. read more

Lead-Free Flux Technology and Influence on Cleaning

Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi .. read more

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor

Values for printed circuit board (PCB) laminate dielectric constant (Dk) and dissipation factor (Df) used in circuit design and signal integrity (SI) modeling are typically those presented on l .. read more

Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties

Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic .. read more

Solder Paste Residue Corrosivity Assessment: Bono Test

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00 .. read more

A Novel Halogen-Free Material for High Speed PCB

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. read more

Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins

An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame retardant epoxy resins use bromine-containing flame-retardants. In t .. read more

Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies

The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability .. read more

Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate material properties thereby creating a shift in the performance and re .. read more

Designers Guide to Lead-Free SMT: Components,PCB Materials,Plating and Surface Coatings

For decades the manufacturers of electronic components have furnished products that were most compatible with soldering processes that employed a eutectic alloy composition that contained tin a .. read more

Design for Low-Halogen Green Electronics

Green Design has recently gained significant interest in the electronics industry all over the world and will remain one of the hottest topics for the upcoming years. Besides reduction of consu .. read more

Challenges toward Implementing a Halogen-Free PCB Assembly Process

The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro .. read more

RoHS and Green Compliance in IC Packaging

In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag .. read more

Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates

Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As operating frequencies increase beyond one Gigahertz the availability .. read more

A Comparative Study of PWB’s Containing Halogenated and Halogen Free Flame-Retardants

In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison between several different PWB’s each having different flame-retardant package .. read more