Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. read more
Halogen Free Solder Paste
•What is a halogen?
•Impact on the environment
•Halides and halogens
•Halides in electronics
•Halogens in electronics
•Definition of halogen free
•Technical challenges to remove halogen
•Curren
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
Designers Guide to Lead-Free SMT: Components,PCB Materials,Plating and Surface Coatings
For decades the manufacturers of electronic components have furnished products that were most compatible with soldering
processes that employed a eutectic alloy composition that contained tin a
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. read more
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. read more
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. read more
The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. read more
Halogen Free Solder Paste
•What is a halogen?
•Impact on the environment
•Halides and halogens
•Halides in electronics
•Halogens in electronics
•Definition of halogen free
•Technical challenges to remove halogen
•Curren
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Polyphenylene Ether Macromolecules. VI. Halogen Free Flame Retardant Epoxy Resins
An important criterion for dielectric materials used in the microelectronics industry is their flammability. Typically,flame
retardant epoxy resins use bromine-containing flame-retardants. In t
.. read more
Lead-Free Flux Technology and Influence on Cleaning
Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
Designers Guide to Lead-Free SMT: Components,PCB Materials,Plating and Surface Coatings
For decades the manufacturers of electronic components have furnished products that were most compatible with soldering
processes that employed a eutectic alloy composition that contained tin a
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. read more
RoHS and Green Compliance in IC Packaging
In this report,BGA packages with conventional and green material combination were selected as test vehicles for the investigation of MSL/temperature rating at the packaging level. The IC packag
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Application of Thermal Analysis Techniques to Determine Performance Entitlement of Base Materials through Assembly
Multiple soldering assembly steps are essentially
standard for PWBs based on current technologies and
needs. A variety of tests are currently in use to
evaluate the performance of finished PWBs
.. read more
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. read more