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HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. read more
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. read more
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. read more
Optimization of Lead Free SMT Reflow & Rework Process Window
Elevated SMT reflow temperatures for Pb-free soldering are placing excessive thermal demands on certain families of
electronic components. The High Density Package Users Group,HDPUG,Consortium
.. read more
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. read more
Via (Plated Through Hole) Integrity with Lead Free Soldering
Bare printed wiring board materials require changes from today’s typical standard dicy cured FR4 materials in order to
support lead-free assembly. The High Density Packaging User’s Group has co
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more