Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. read more
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials
•Overview
•Test Method Considerations
•Proposed Test Methodology
•PCB,Stencil & Part Information
•Pick-up Adapter Design
•Test Setup Overview
•Head-in-Pillow Defect Detection
•Test Parameters
•
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Head-In-Pillow: Are we still Snoozing?
-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other
.. read more
Detection of Head-on-Pillow Defects Using 5DX Method
Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t
.. read more
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. read more
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices
Machine Learning
Edge Computing
Edge AI
Demonstrated using a Case Study on HiP (Head in Pillow) defect detection
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
.. read more
Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C
.. read more
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. read more
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. read more
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Application of the Advanced Activator Technology on Halogen-Free Lead-Free Solder Paste Development
The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin
.. read more
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. read more
Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials
•Overview
•Test Method Considerations
•Proposed Test Methodology
•PCB,Stencil & Part Information
•Pick-up Adapter Design
•Test Setup Overview
•Head-in-Pillow Defect Detection
•Test Parameters
•
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Head-In-Pillow: Are we still Snoozing?
-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other
.. read more
Detection of Head-on-Pillow Defects Using 5DX Method
Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t
.. read more
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly
The head-in-pillow defect has become a relatively common failure mode in the industry since the implementation of Pb-free
technologies,generating much concern. A head-in-pillow defect is the in
.. read more
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. read more
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more