Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Solderability of Sn/Cu Lead-Free Solder as a HASL Bare Board Final Finish
Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu
surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both
.. read more