Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are
.. read more
A System of Producing High-Powered RF Circuit Boards Employing a Low-CTE,Thermally Engineered Metalized Layer
The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a ther
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. read more
Current Carrying Capability of Electrically Conductive Adhesives for High Power Applications
Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the
epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e
.. read more
High-Performance Phase Change Metal TIMs
For the last several years, we have seen an increase in liquid metal usage as a thermal interface material (TIM) in the semiconductor industry. The primary reason for this increase is that h
.. read more
Critical Factors for Minimizing Interfacial Resistance in Thermal Interface Material Applications
Thermal interface material (TIM) is an integral part of thermal management strategies for electronic applications. TIM is commonly used in between a heat generating component (e.g. microelec
.. read more
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. The benefits of embedding active die
.. read more
Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are
.. read more
A System of Producing High-Powered RF Circuit Boards Employing a Low-CTE,Thermally Engineered Metalized Layer
The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a ther
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. read more
Current Carrying Capability of Electrically Conductive Adhesives for High Power Applications
Various Ag-filled epoxies were subjected to a current carrying capability study in which current was applied to the
epoxies at temperatures of up to 170°C for 1008 hours. Test devices with Ag e
.. read more