Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
New Challenges for Higher Aspect Ratio: Filling Through holes and Blind Micro Vias with Copper by Reverse Pulse Plating
This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more