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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
The Effects of Lead-Free Reflow on Conductive Anodic Filament (CAF) Performance of Materials
This paper details the results achieved by the High Density Packaging Users Group (HDPUG) Consortium investigating the hole-wall to hole-wall CAF performance of 20 different Pb-free printed wir
.. read more
A Standard Multilayer Printed Wiring Board for Material Reliability Evaluations
This paper details the Alcatel-Lucent Pb-free Material Reliability Test board (MRT) used in two different High Density Packaging User Group tests covering 56 different constructions and in nume
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more