Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
FVSS (Free Via Stacked up Structure)
The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase
.. read more
Development of High Density Wiring Technology and Interconnect Technology with Silicon Through-Hole
We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as
a dielectric material,and interconnect technology with Silicon through-hol
.. read more
FVSS (Free Via Stacked up Structure)
The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase
.. read more