Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
.. read more
Design, Fabrication and Testing of an RFID Tag with Security Features for Authentication and Tamper Resistance
To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billeri
.. read more
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. read more
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. read more
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Comparing the Reliability Performance of Electroless Palladium and Autocatalytic Gold in Production Environment
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman
.. read more
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. read more
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. read more
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. read more
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
.. read more
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Buried Capacitance and the Evolution of Thin Laminates
Buried Capacitance1 (BC) laminates products have been in use in many high-speed applications for more than ten
years. BC products are a significant contributor to complex multi-layer printed ci
.. read more
High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates
Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As
operating frequencies increase beyond one Gigahertz the availability
.. read more
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
.. read more
Design, Fabrication and Testing of an RFID Tag with Security Features for Authentication and Tamper Resistance
To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billeri
.. read more
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. read more
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. read more
Thermally Conductive, EMI Shielding Materials for High Frequency Radio Waves
Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniatu
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Comparing the Reliability Performance of Electroless Palladium and Autocatalytic Gold in Production Environment
The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman
.. read more
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
Low dk Thermoplastic Substrate for Broadband Antennas
In high frequency circuit boards PTFE is widely used as a substrate material. It offers very low dielectric constant and low losses. However,it is relatively expensive to fabricate,making the c
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Base Material Consideration for High Speed Printed Circuit Boards
Over the years,the EU RoHS restriction and lead-free capability is the hottest environmental protection subject. In technology trends,signal integrity performance gets more critical based upon
.. read more
Novel CCL Based on New Fluoropolymer Exhibits Extremely Low Loss Characteristics and New Evaluation Method for Separating Dielectric and Conductive...
We demonstrate here a novel CCL (Copper Clad Laminate),which exhibits an extremely low transmission loss at mm-wave band. The CCL,which we developed,is based on a new fluoropolymer with adhesiv
.. read more
Assessing the Reliability of New Connector Designs
With the combination of increased product complexity,increased frequencies and ever decreasing component sizes and
pitches designers are faced with the dilemma on how design their products in t
.. read more
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. read more
Next Generation High Density Build-Up PKG Substrate
In recent years,along with the further progress of network systems,mobile communication systems and high performance
servers printed wiring boards (PWBs),which are key components in these produ
.. read more
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Buried Capacitance and the Evolution of Thin Laminates
Buried Capacitance1 (BC) laminates products have been in use in many high-speed applications for more than ten
years. BC products are a significant contributor to complex multi-layer printed ci
.. read more
High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates
Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As
operating frequencies increase beyond one Gigahertz the availability
.. read more