Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
.. read more
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. read more
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. read more
Design Optimization of SI Test Coupon to Achieve Accurate Measurement for 112Gbps/PAM-4 PCB Board
To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decre
.. read more
Copper Foil Elements Affecting Transmission Loss with High Speed Circuits
Large data transmission continues to increase at the rate of 20% worldwide annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Elect
.. read more
Effect of No-clean Solder Paste and Flux on Reliability of High Frequency Circuits
The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process.
The presence of solder flux residues,solder mask,underfill or any SMT material
.. read more