Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Cleaning in an HDI World
For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist
.. read more
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more
Cleaning in an HDI World
For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist
.. read more
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability
With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array
package (FCBGA) is used more popularly in recent years. The FCBGA package
.. read more
Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays
Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are
also more complex in structure than “standard” BGAs and are generally target
.. read more
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. read more
Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component
Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has
passed legislation requiring the removal of lead from electronics assembly b
.. read more
Implementation of High I/O Count 1mm Pitch BGA Technology
Electronic package size reduction and demand for increased functions within less board space make a challenge for
the PCB designer to find smaller footprint components that will out perform lar
.. read more