Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac
.. read more
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. read more
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. read more
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. New, streamlined and hybrid pac
.. read more
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of
withstanding Pb-free soldering processes used in the assembly of RoHS comp
.. read more
Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability
printed wiring boards used in single and double sided surface mount
.. read more