Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
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Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. read more
Pb-free Solder Joint Reliability in a Mildly Accelerated Test Condition
Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so
.. read more