Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
.. read more
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Options for Assembly using High Temperature Interconnection Technologies
There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics
.. read more
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. read more