Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Reaching Across Data Silos in the Electronics Supply Chain to Achieve Parts-Per-Billion Quality Levels
With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri
.. read more
Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
.. read more
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
Transmission Line Characterization through the Enhanced Root Impulse Energy Loss
In today’s PCB industry,the challenges are no longer just on how to control and improve the manufacturing
processes,but also to ensure the fabricated product is compliant to the industry standa
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provid
.. read more
Reaching Across Data Silos in the Electronics Supply Chain to Achieve Parts-Per-Billion Quality Levels
With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri
.. read more
Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
.. read more
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
Transmission Line Characterization through the Enhanced Root Impulse Energy Loss
In today’s PCB industry,the challenges are no longer just on how to control and improve the manufacturing
processes,but also to ensure the fabricated product is compliant to the industry standa
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Quantitative Evaluation of New SMT Stencil Materials
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase,so do the challenges of maintaining a successfu
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. read more
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
.. read more