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New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Development of High Density and High Frequency Substrate Using B^2it Technology for Next Generation Packaging
For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology
.. read more
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. read more
Development of High Density and High Frequency Substrate Using B^2it Technology for Next Generation Packaging
For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology
.. read more