Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices

Machine Learning  Edge Computing Edge AI Demonstrated using a Case Study on HiP (Head in Pillow) defect detection .. read more

Head-on-Pillow Defect Detection - X-ray Inspection Limitations

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Pack .. read more

Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials

•Overview •Test Method Considerations •Proposed Test Methodology •PCB,Stencil & Part Information •Pick-up Adapter Design •Test Setup Overview •Head-in-Pillow Defect Detection •Test Parameters • .. read more

Bringing AI To The Edge A Collaborative Study Of Defect Detection In Surface Mount Devices

Machine Learning  Edge Computing Edge AI Demonstrated using a Case Study on HiP (Head in Pillow) defect detection .. read more

Head-on-Pillow Defect Detection - X-ray Inspection Limitations

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Pack .. read more

Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials

•Overview •Test Method Considerations •Proposed Test Methodology •PCB,Stencil & Part Information •Pick-up Adapter Design •Test Setup Overview •Head-in-Pillow Defect Detection •Test Parameters • .. read more