Knowledge Hub

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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Liquid Flux Selection and Process Optimization for Selective Soldering Applications

There has been a rapid increase in the use of selective soldering equipment for PCB assembly –Lower equipment costs –Smaller equipment footprint –Lower solder “inventory” cost (smaller pots) –D .. read more

Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering

Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially .. read more

Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red .. read more

Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications

With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin .. read more

Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings

With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper .. read more

Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability

In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m .. read more

Effect of Contact Time on Lead-Free Wave Soldering

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics .. read more

The Lead-Free Wave Solder Process and Its Effect on Laminates

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

The Lead-Free Wave Solder Process and Its Effect on Laminates

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

Large and Thick Board Lead-Free Wave Soldering Optimization

This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of .. read more

Liquid Flux Selection and Process Optimization for Selective Soldering Applications

There has been a rapid increase in the use of selective soldering equipment for PCB assembly –Lower equipment costs –Smaller equipment footprint –Lower solder “inventory” cost (smaller pots) –D .. read more

Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering

Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially .. read more

Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

The globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to red .. read more

Processing High Density Interconnects: Selecting the Best Option for Via Fill Applications

With the increased use of High Density Interconnects in printed wiring boards (PWB) there is a critical need for reliable methods to completely fill through hole and blind vias. Complete fillin .. read more

Final Finishes for High Temperature Applications: A Comparison of OSP and Immersion Silver Final Finish Coatings

With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper .. read more

Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability

In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m .. read more

Effect of Contact Time on Lead-Free Wave Soldering

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics .. read more

The Lead-Free Wave Solder Process and Its Effect on Laminates

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

The Lead-Free Wave Solder Process and Its Effect on Laminates

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. read more

Large and Thick Board Lead-Free Wave Soldering Optimization

This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of .. read more