Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
.. read more
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work
.. read more
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment
An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. read more
Comparative Assessment of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solders
Current leakage on a printed circuit board (PCB) can occur due to a reduction in surface insulation resistance (SIR) between adjacent conductors. This is frequently caused by electrochemical mi
.. read more
Optimizing Immersion Silver Chemistries for Copper
Immersion silver chemistry has been promoted as a final finish for solderability for several years now. There are different commercially available products that will deposit silver in a wide ra
.. read more
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
.. read more