Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode .. read more

Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing

High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur .. read more

Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability

Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is expected to continue. Markets utilizing these designs include high pe .. read more

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode .. read more

Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing

High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur .. read more

Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability

Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is expected to continue. Markets utilizing these designs include high pe .. read more