Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies
In recent years there has been an increasing emphasis on miniaturization of Board Mount Power (BMP) modules and electronic subassemblies. In addition there has been a shift from predominately t
.. read more
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. read more
NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test
Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging
.. read more
MSL Rating and Packaging Requirements of PCBs used in Board Mounted Power Assemblies
In recent years there has been an increasing emphasis on miniaturization of Board Mount Power (BMP) modules and electronic subassemblies. In addition there has been a shift from predominately t
.. read more
Solder Paste Wetting and Solder-Balling Evaluation: A Quantitative Statistical Approach Using DOE
The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is
key to proper solder joint formation. Robust solder paste performance is needed
.. read more