Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. read more
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
.. read more
Rapid Assessment of Solder Resist-Related Electrochemical Reliability Issues
In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as
.. read more
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
.. read more