Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more
Assembly Challenges of Die and Die-Size BGAs
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level
.. read more
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
Solder Joint Reliability Qualification of Various Component Mounting Modification Configurations Using Thermal Cycle Testing
The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design
specific activity. The implementation and use of a standardized s
.. read more