Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. read more
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. read more
Board Thickness Effect on Accelerated Thermal Cycle Reliability
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehi
.. read more
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. read more