Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou
.. read more
Numerical Study on New Pin Pull Test for Pad Cratering Of PCB
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more
Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou
.. read more
Numerical Study on New Pin Pull Test for Pad Cratering Of PCB
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more