Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. read more
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. read more
Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA?
Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. The
.. read more
SIR Intercomparison to Validate the use of a Fine Pitch Pattern
It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. read more