Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Overcoming the Challenges for Implementing IPC-J-STD-001 in Your Factory
On February 7, 2024, this webinar addressed common challenges manufacturers face when implementing IPC-J-STD-001 in their factories. The session shared practical solutions and insights to he
.. read more
Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads
IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t
.. read more
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. read more
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. read more
Overcoming the Challenges for Implementing IPC-J-STD-001 in Your Factory
On February 7, 2024, this webinar addressed common challenges manufacturers face when implementing IPC-J-STD-001 in their factories. The session shared practical solutions and insights to he
.. read more
Optimizing Thermo-Mechanical Reliability of Components with Flat Gull Wing Leads
IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t
.. read more
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. read more
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. read more