Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Challenges Associated with Non-Clean Liquid Flux Selection to Meet Industry Standards
The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Challenges Associated with Non-Clean Liquid Flux Selection to Meet Industry Standards
The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i
.. read more
A Novel Solution for No-Clean Flux Not Fully Dried Under Component Terminations
The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more