Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. read more
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD). Multiple Reball Trial and...
Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres
.. read more
Development of a Consistent and Reliable Thermal Conductivity Measurement Method,Adapted to Typical Composite Materials Used in the PCB Industry
Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo
.. read more
Round Robin of High Frequency Test Methods by IPC-D24C Task Group
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technolo
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. read more
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
Using Personal Digital Assistants from Alaska to Zanzibar the Dielectric Constant and Dissipation Factors of Non-Woven Aramid/FR4 Laminates For a...
Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o
.. read more
Reliable Young's Modulus Value of High Flexible Treated Rolled Copper Foils Measured by Resonance Method
Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex
.. read more
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a
.. read more
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. read more
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. read more
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Reliability of Ball Grid Arrays Converted from Pb-free to Tin-Lead by Robotic Hot Solder Dip (RHSD). Multiple Reball Trial and...
Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres
.. read more
Development of a Consistent and Reliable Thermal Conductivity Measurement Method,Adapted to Typical Composite Materials Used in the PCB Industry
Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo
.. read more
Round Robin of High Frequency Test Methods by IPC-D24C Task Group
Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l
.. read more
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?
The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att
.. read more
Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technolo
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. read more
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. read more
An Issue in Time to Delamination (T260) Testing for PCBs
It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen
at 260°C decreases with the specimen thickness. A temperature gra
.. read more
Using Personal Digital Assistants from Alaska to Zanzibar the Dielectric Constant and Dissipation Factors of Non-Woven Aramid/FR4 Laminates For a...
Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o
.. read more