Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. read more
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. read more