Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more