Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. read more
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. read more
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
.. read more
Integrated Electrical Test within the Production Line
Many companies use “one stop testing” as a solution to the test issues in a manufacturing environment rather than discrete
“islands of test”. Low volume,high mix electronic manufactures are con
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards
Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture
All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post
.. read more
Solving Today’s Test Challenges: Razor Sharp Probes
Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability
Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w
.. read more
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
A Boundary-Scan Infrastructure for Linking Design and Manufacturing Test
This paper will discuss:
a. Boundary scan as a key test tool that enables the leveraged test approach
b. The advantages of standardizing and reusing design verification tests and PLD programs i
.. read more
Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing
Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co
.. read more
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. read more
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
Sources in A Production Line (SMT) and Solutions against ESD (Electrostatic Discharge) - Requirements Today and In The Future
The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo
.. read more
Integrated Electrical Test within the Production Line
Many companies use “one stop testing” as a solution to the test issues in a manufacturing environment rather than discrete
“islands of test”. Low volume,high mix electronic manufactures are con
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
HDI Training & Implementation at Eagle Test Systems
Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards
Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition
.. read more
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. read more
ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture
All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post
.. read more
Solving Today’s Test Challenges: Razor Sharp Probes
Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability
Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w
.. read more
Results from 2007 Industry Defect Level and Test Effectiveness Studies
To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
Test and Inspection as Part of the Lead-Free Manufacturing Process
The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free
manufacturing. Since there are exemptions of which product types are mandated
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
A Boundary-Scan Infrastructure for Linking Design and Manufacturing Test
This paper will discuss:
a. Boundary scan as a key test tool that enables the leveraged test approach
b. The advantages of standardizing and reusing design verification tests and PLD programs i
.. read more